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NTGS3441, NVGS3441
Power MOSFET
1 Amp, 20 Volts, P ? Channel TSOP ? 6
Features
?
?
?
?
?
Ultra Low R DS(on)
Higher Efficiency Extending Battery Life
Miniature TSOP ? 6 Surface Mount Package
NV Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC ? Q101 Qualified and
PPAP Capable
These Devices are Pb ? Free and are RoHS Compliant
http://onsemi.com
1 AMPERE
20 VOLTS
R DS(on) = 90 m W
P ? Channel
Applications
? Power Management in Portable and Battery ? Powered Products,
i.e.: Cellular and Cordless Telephones, and PCMCIA Cards
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
3
1 2 5 6
Rating
Symbol
Value
Unit
Drain ? to ? Source Voltage
V DSS
? 20
V
4
Gate ? to ? Source Voltage ? Continuous
Thermal Resistance
Junction ? to ? Ambient (Note 1)
Total Power Dissipation @ T A = 25 ° C
Drain Current ? Continuous @ T A = 25 ° C
? Pulsed Drain Current (T p t 10 m S)
Thermal Resistance
Junction ? to ? Ambient (Note 2)
Total Power Dissipation @ T A = 25 ° C
Drain Current ? Continuous @ T A = 25 ° C
? Pulsed Drain Current (T p t 10 m S)
V GS
R q JA
P d
I D
I DM
R q JA
P d
I D
I DM
" 8.0
244
0.5
? 1.65
? 10
128
1.0
? 2.35
? 14
V
° C/W
W
A
A
° C/W
W
A
A
1
TSOP ? 6
CASE 318G
STYLE 1
MARKING DIAGRAM &
PIN ASSIGNMENT
Drain Drain Source
6 5 4
PT M G
G
1 2 3
Thermal Resistance
Junction ? to ? Ambient (Note 3)
Total Power Dissipation @ T A = 25 ° C
Drain Current ? Continuous @ T A = 25 ° C
? Pulsed Drain Current (T p t 10 m S)
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering
Purposes for 10 Seconds
R q JA
P d
I D
I DM
T J , T stg
T L
62.5
2.0
? 3.3
? 20
? 55 to 150
260
° C/W
W
A
A
° C
° C
Drain Drain Gate
PT = Specific Device Code
M = Date Code*
G = Pb ? Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Minimum FR ? 4 or G ? 10 PCB, operating to steady state.
2. Mounted onto a 2 ″ square FR ? 4 board (1 in sq, 2 oz. Cu. 0.06 ″ thick single
sided), operating to steady state.
3. Mounted onto a 2 ″ square FR ? 4 board (1 in sq, 2 oz. Cu. 0.06 ″ thick single
sided), t t 5.0 seconds.
ORDERING INFORMATION
Device Package Shipping ?
NTGS3441T1G TSOP ? 6 3000 / Tape & Reel
(Pb ? Free)
NVGS3441T1G
TSOP ? 6
3000 / Tape& Reel
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2012
October, 2012 ? Rev. 6
1
Publication Order Number:
NTGS3441T1/D
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